iPhone 16 Series: Motherboard Component Annotation Diagram/Point Diagram
After the iPhone 16/16 Plus/16 Pro/16 Pro Max motherboard diagrams and component IC bitmaps were released, iPhone16/16plus/16pro/16pro Max point diagrams/circuit diagrams/multi-layer diagrams and component annotation diagrams were also released one after another. The detailed roadmap and component notes of iPhone Motherboard components highlight the complex motherboard architecture of the iPhone 16 series in detail.

Since the release of iPhone 16, it has attracted a lot of attention, both from iPhone enthusiasts and from those who specialize in the iPhone series. The iPhone 16 series introduces several notable upgrades over the iPhone 15 series. It comes with a bigger battery, more RAM, and new hardware buttons for enhanced functionality. The camera system has been improved with a new ultra-wide-angle lens and the addition of spatial audio recording capabilities. The design includes subtle changes and the integration of generative AI into iOS. These enhancements make iPhone 16 even more powerful in terms of performance and innovative features.

Understand iPhone 16 series component annotation diagrams

The iPhone 16 series (including 16, 16 Plus, 16 Pro and 16 Pro Max) has detailed component annotation diagrams. Key components include the A18 CPU RAM chip, iPhone Nand Memory Chip and wireless communication module. These diagrams provide an overview of key hardware component distribution and The layout provides a glimpse into the complex structure behind the components of Apple's latest smartphone.


 

  • A18 CPU and A18 Pro: These are the central processing units that enhance the performance and efficiency of the device.
  • NAND memory chip: Responsible for data storage, allowing quick access to applications and files.
  • Wireless Charging IC: manages the wireless charging function of the device.
  • Camera Power IC: Powers the upgraded 48-megapixel main fusion camera system.
  • Audio Codec IC: Handles audio processing for high-quality sound output.
  • Power management IC: Optimize battery life and performance by managing power distribution.
  • WIFI/Bluetooth module: Facilitates wireless connectivity, enabling Internet access and device pairing.
  • Baseband CPU: manages cellular communications and ensures connectivity to mobile networks.
  • Power Amplifier: Enhances signal strength for better reception and transmission.
  • GPS IC: Provides positioning services by connecting to satellite signals.
  • SIM card connector: Allows mobile network connectivity via a physical SIM card, although US models use eSIM technology.
  • Camera System Components: Pro models include an advanced camera control system with a dedicated IC that enables features such as optical image stabilization.
  • Charging Port Connector: Connect the device to a power source to charge.

In addition to the above iPhone 16 series component annotation diagrams, iPhone16/16plus/16pro/16pro Max point diagrams/circuit diagrams/multi-layer diagrams have also been released.


More iPhone16 series motherboard component diagrams are also being continuously updated. Follow China Phonefix to learn more about the iPhone16 series. At the same time, the Phonefix store will also provide you with a series of iPhone Accessories and Cell Phone Repair Tools.
Iphone16Iphone16 proIphone16 pro max

Leave a comment

All comments are moderated before being published