WL Universal BGA Reballing Stencil Positioning Mold for iPhone - CHINA PHONEFIX
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WL Universal BGA Reballing Stencil Positioning Mold for iPhone - CHINA PHONEFIX

WL Universal BGA Reballing Stencil Positioning Mold for iPhone

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PHONEFIXSKU: VC729
Price:
$6.99 USD $7.99 USD

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Stock:
In stock

Description

WL High-Quality Universal Repair Holder for CPU NAND Baseband Tin Plate Steel Net BGA Reballing Stencil Positioning Mold with Fixed Plate.

Description:
  • WL BGA Reballing Stencil Positioning Mold for WL BGA Reballing Stencil
  • Universal Aluminum Mould Base for WL 0.1mm BGA Reballing Stencil
  • Magnetic cell phone BGA reballing stencil positioning mold for BGA Chip repair
  • Compatible with: iPhone 5 5C 5S 6 6S 6P 6SP 7 7P / A6 A7 A8 A9 A10

Package included:
  • 1pc x Holder

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