Tool Sets 4 piece Universal BGA Stencil for Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Heat.
Features:
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.
BGA Reballing Stencil only, other accessories demo in the picture is not included!
Specifications:
Item Type: BGA Reballing Stencil
Material: Stainless Steel
Size: Standard Size
Color: Silver
Quantity: 4PCS
Note:
No retail package.
Transition: 1cm=10mm=0.39inch
Please allow 1-3mm error due to manual measurement. pls make sure you do not mind before you bid.
Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
Package Includes:
4 x BGA Reballing Stencils
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