30g Thermal pads conductive heatsink insulative plaster viscous adhesive. MaAnt DR-4 DR-6 DR-8 high thermal silicone paste for phone/tablet/PC IC Chip CPU GPU VGA RAM LED IC cooler LED radiator cooling, elastic bonding, heat dissipation, insulation, packaging of electronics, instruments, LEDs heat sinks, etc.
KS101:
- It has good conductivity, wide operating temperature range (-60~200°C), and short-term resistance to 300°C.
- It has high strength and fast bonding effect, and is suitable for directly attaching various components, LEDs and heat sinks.
- Good thermal conductivity, strong adhesion, vacuum packaging is not easy to oxidize and dry, good viscosity, short drying time.
- It has short surface curing time, long storage period, non-toxic, solvent-free, and can be safely applied to elastic bonding, heat dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, etc.
Instructions:
- Extrusion of the product directly during use, rubbing the surface of the adherend, and immediately covering it after use, in case of trial again.
- The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa.
- Recommended thickness: 0.1-0.5mm, the thinner the better.
- Please use solvent to clean the surface of the bonded object before use （such as alcohol）, avoid cleaning with detergent, and apply it after the surface is clean.
- The package is sealed and the product is covered with a vacuum bag to insulate the air and increase the storage time.
DR-4/DR-6/DR-8 Thermal Silicone Paste:
- High-temperature resistance without curing.
- Strong thermal conductivity, good insulation, aging resistance, rapid reduction of CPU, and so on Temperature of thermal components.
- CPU companion heat balm, thermal conductivity: 4W/mk, 6W/mk, 8.5W/mk; High thermal conductivity, insulation and high temperature resistance.
- It completes the heat transfer of various uneven gaps and makes up for the thermal conductive silicone sheet and insufficient thermal grease.
- Ant Xin CPU companion heat sink has good high and low-temperature resistance (temperature range -60℃~200℃) and has the characteristics of non-solid and non-powdered silica gel, good thermal conductivity.
- High thermal conductivity, low thermal resistance, good wettability, soft, stress-free and can be compressed to as thin as 0.1mm, can fill any uneven gap, no settlement, no flow, no oil, safe non-conducting.
- Ant Xin CPU companion heat sink applied better thermal conductivity materials, so that it has high Insulation without corrosion and other better performance, so as to protect electronic components, high-power LED lights motherboard, and other service life.
Package includes:
1 x Thermal Paste
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