TBK 2202 Foldable 3D Thermal Imaging Camera PCB Fault Diagnosis Instrument For Mobile Phone motherboard fault analysis, detection and diagnosis. TBK R2202 infrared thermal camera detects fault points on the motherboard circuit board quickly and accurately.
Specification:
Model: TBK 2202 3D thermal camera.
Resolution: 256*192.
Wavelength Range: 7.5um-13.5um.
Camera Angle: 250*18°.
Temperature Measurement Range: -20℃-550℃.
Temperature Measurement Distance: 5cm~25cm.
Supported Platforms: Android, Windows.
Product Size: 150*150*180mm.
Package Size: 205*205*70mm.
Please note: Macro lens must be purchased separately.
Features:
1. TBK 2202 3D thermal imaging fault diagnosis instrument quickly and accurately detects fault points on the motherboard circuit through infrared thermal imaging technology.
2. 3D thermal field distribution technology can display the motherboard from different angles and directions temperature changes, making faulty components more clearly visible.
3. Intelligent troubleshooting automatically analyzes thermal imaging data to track motherboard failure points.
4. Fault detection knows at a glance quickly locate faulty components.
5. Can be connected to mobile phones, tablets, and computers, three connections are easy to use, support Android system, Windows system.
6. Using a high-resolution thermal imager, it can display the temperature distribution on the motherboard, and make faulty components visible at a glance.
7. Lens height can be adjusted up or down to make the focus clearer.
8. The product is foldable and has a lightweight design, making it easy to carry and store and suitable for various maintenance occasions.
Option:
1. TBK 2202 3D thermal camera standard set (without macro lens).
2. TBK 2202 3d thermal camera with macro lens.
3. Macro lens only.
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