Qualcomm Qu1/2/3/4 MSM series BGA reballing stencil templates, universal BGA reballing stencil template MSM8996 MSM7225A MSM8953 MSM8994, multi-purpose QCOM CPU MSM universal BGA soldering stencils kit, PCU BGA reball stencils kit for Huawei Samsung Android mobile phone repair
Qualcomm Multi-purpose QCOM CPU MSM BGA Reballing Stencils Kit Soldering Template For Mobile Phone Reballing Repair Tool[ Optional Types ] :
- Option 1: QU1 MSM8996 A/B MSM8976 A/B MSM8992 A/B.
MSM8976=MSM8956
- Option 2: QU2 MSM8953 B01/1AB MSM8937 MSM8998 A/B MSM8916
MSM8916=8929/8939/8216/8636/8939
MSM8937=8940/8917
- Option 3: QU3 MSM7225A MSM8928 B MSM8940 MSM8937 SDM660 MSM8909 MSM8928 A MSM8952 MSM8612.
MSM8928=8926/8226/8228/8628/8626/8526
MSM7225A=7227A/7625A/7627A/8225/8255Q/8625/8625Q
MSM8621=8610/8212/8210/8112
MSM8940=8937/8917
- Option 4: QU4 MSM8994 A/B MSM8974 A/B MSM8960 A/B
MSM8974=8274/8674
Product Features :
- Amaoe Imported Japan for universal phone BGA reballing stencil template
- 100% new brand and high quality.
- Super thin thickness, just 0.12mm, easy to use.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- 100%: High quality
- Material: Imported Japan steel sheet
- Color: As pictures show
- Type: Amaoe universal BGA reballing template
- Thickness: 0.12mm
- Design: Heat dissipating holes design
- Application: For Android phone BGA reballing soldering repair
- Unit Type: Piece
- Suitable for: for general rework station
- Function: for phone BGA reballing
Package includes :
- 1pcs x BGA Reballing Stencil
