QianLi Bumblebee BGA Reballing Stencils For iPhone 6-15 Pro Max

Save $1.00
PHONEFIXSKU: XZ2325

Option: 6/6P
Price:
Sale price$1.99 USD Regular price$2.99 USD

Shipping calculated at checkout

Stock:
Sold out

Description

QianLi ToolPlus Bumblebee 2D BGA Reballing Stencils for iPhone 6-15 Pro Max motherboard CPU Nand chip soldering repair. Qianli Bumblebee square holes round angle BGA stencils stainless steel mesh for iPhone 6/6P/6S/6SP/7/7P/8/8P/X/XS/XS MAX/XR/11/11 Pro/11 Pro Max/12/12 Pro/12 mini/12 Pro Max/13/13mini/13 Pro Max/14/ 14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max.

Features:
1. Qianli ToolPlus Bumblebee iPhone series stencil.
2. Sturdy, precise and durable over time.
3. Easier to use even more precisely.
4. Square holes round angle BGA stencils, sliver.
5. For iPhone 6-15 Pro Max A8-A17 Pro CPU.

RECOMMENDED

Recently viewed