PPD 138/183℃ lead free low temperature solder paste for iPhone A8 A9 A10 A11 CPU IC chip repair, PPD best melting point 138/183 degrees lead-free low temperature solder paste for iPhone A8 A9 A10 A11 IC chip special tin planting.
The solder paste with a melting point of 183 degrees is called low temperature lead-free solder paste, and its alloy composition is SnBi. When the components of the patch can not withstand temperatures above 183 C, the solder paste is welded with low temperature solder paste. To protect against high temperature.
Note: Solder paste flux can only be sent out by special mail post.
Product Features :
- Excellent capacity of solder-stickiness
- Excellent Anti-wet capacity
- Widely used on BGA, PGA, CSP packages and flip chip operation
- Suitable for multiple PCB reflow
- No-clean and Lead free for environmental protection
Optional Model :
- Option 1: 138℃ S-260
- Option 2: 183℃ S-600
Volume: 50g/bottle
Temperature: 138℃/183℃ (S-260/S-600)
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Packing List :
Skip to content