Amaoe BGA Reballing Stencil MU1 MU2 MU3 MU4 tin planting steel mesh for Android MTK CPU Series MT6795 MT6582 MT6762 MT6873V MT6765V. Multi-purpose 0.12MM BGA reballing stencils template for cellphone CPU motherboard repair tool.
Option:
MU:1 stencil: MT6795W, MT6797W, MT6595, MT6732, MT6750, universal CPU upper layer.
MU:2 stencil: MT6582, MT6735, MT6589, MT6572A, MT6580A, MT6755.
MU:3 stencil: MT6260DA, MT6762V/MT6765V, MT6739V, MT6785V, MT6757V, MT6771V, MT6763V, MT6873V.
MU:4 stencil: MT6885Z, MT6853V, MT6769V, MT6779V, MT6885Z/MT6891Z RAM, MT6891Z, MT6758V, MT6768V.
Product Features:
- Amaoe Imported Japan for universal phone BGA reballing stencil template
- 100% new brand and high quality.
- Super thin thickness, just 0.12mm, easy to use.
- Special designed: Heat dissipating holes design.
- High quality steel material, can work great with any universal phone repair BGA rework station.
- Offer the best BGA Repair solution for phone heating repair.
Product Specifications :
- Item name: BGA Reballing Stencil Template
- 100%: High quality
- Material: Imported Japan steel sheet
- Color: As pictures show
- Type: Amaoe universal BGA reballing template
- Thickness: 0.12mm
- Design: Heat dissipating holes design
- Application: For Huawei phone BGA reballing soldering repair
- Unit Type: Piece
- Suitable for: for general rework station
- Function: for phone BGA reballing
Package includes :
- 1pcs x BGA Reballing Stencil
