MIJING High Purity Tin Paste 138/158/183/199℃ Solder Paste for mobile phone motherboard/electronic circuit board/BGA chip welding repair. Large mouth bottle, easy to use. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points, suitable for various electronic motherboard BGA chip soldering and repair.
Option:
1. MIJING 138℃ High Purity Tin Paste 50g.
3. MIJING 158℃ High Purity Tin Paste 50g.
4. MIJING 183℃ High Purity Tin Paste 50g.
5. MIJING 199℃ High Purity Tin Paste 50g.
Features:
1. MIJING 138℃ 158℃ 183℃ 199℃ High Purity Tin Paste, 50G per box.
2. Square mouth design, easy to use, easy to recycle excess solder paste, reducing waste.
3. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points.
4. More stable welding, reducing the problem of false soldering.
5. Suitable for mobile phone motherboard/electronic circuit board/BGA chip welding repair.
6. Suitable for various electronic motherboard BGA chip soldering and repair.
7. It is a necessary solder paste for daily mobile phone repair.
