Mijing CH5 Intelligent motherboard preheating layered desoldering platform with CH5 CH5-BC CH5-E mold for iPhone X-12 Pro Max motherboard disassembly. Mijing CH5 motherboard heating separating welding platform for iPhone 12/11/X series PCB mainboard layering.
1. Preheating platform for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12mini/12 Pro/12 Pro Max motherboard layering, support CPU chip, HHD Nand flash, Baseband, glue removal.
2. Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.
Option:
1. MIJING CH5 host (new version).
2. CH5 X/XS/XS MAX 3 in 1 groove.
3. CH5 B/C groove 3 in 1 for iPhone 11/11 Pro/11 Pro Max.
4. CH5 E groove 4 in 1 for iPhone 12/12 mini/12 Pro/12 Pro Max.
Please note that the old CH5 host (low power) is not compatible with the new 12 series modules. The new 12 series modules require the use of the new version of the CH5 host (high power)
MIJING CH5 Main Unit:
- Product Size: 159 mm*89mm*48mm
- Material: Aluminum alloy
- Input voltage: 110V~220V
- Output voltage: 24V
Extended Heating Station:
- Product Size: 164mm*92mm*40mm
- Color: Grey + Blue
- Material: Aluminum alloy
- Double male adapter cable: 1m
- Power cable: 1m
- Max temperature: 300℃
- Min temperature: 100℃
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