AMAOE Mbga-IP WiFi/Baseband/CPU/NAND BGA Reballing Stencil Kit Soldering Steel Mesh Platform for iPhone 7-15 Pro Max.Mbga-IP 26 in 1 BGA reballing stencil platform for Planting tin & Degumming CPU, hard drive, WIFI, baseband welding Repair.
Option:
Mbga-IP 26 in 1 set ( 7-15PM)
Mbga-IP 14/14P kit Positioning plate
Mbga-IP 12/13 kit Positioning plate
Mbga-IP XS/11 kit Positioning plate
Mbga-IP 7/8/X Qualcomm kit Positioning plate
Mbga-IP 7/8/X Intel Kit Positioning plate
M-IP14-A16 stencil Kit (0.12mm)
M-IP14-A15 stencil Kit (0.12mm)
M-IP13 stencil Kit (0.12mm)
M-IP12 stencil Kit (0.12mm)
M-IP11 stencil Kit (0.12mm)
M-IPXS stencil Kit (0.12mm)
M-IP8 Qualcomm stencil(0.12mm)
M-IP8-i Intel stencil (0.12mm)
M-IP7 Qualcomm stencil (0.12mm)
M-IP7-i Intel stencil (0.12mm)
Mbga/MFix-UBase base
Features:
- The compatible brand of our product is apple iPhone. Product original from CN(origin).
- The compatible model is iPhone 7/7P/8/8P/X/XS/XS MAX/XR/11/11 Pro/11 Pro Max/12/12 mini/12 Pro/12 Pro Max/13/13 Pro/13 mini/13 Pro Max/14/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max.
- Tin planting and glue removal two-in-one design,Can be partially implanted with tin to remove glue and fix the chip.
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