MaAnt UP-78A Halogen-free SMT soldering flux, MY-223 flux paste with welding oil repair assistant toolkit. MaAnt UP-559 No-clean soldering paste flux grease. MaAnt MY-228 BGA Solder Paste High Viscosity Strong Activity No-clean 20ml White Flux. UGAIN UG-78 Lead-free halogen-free solder flux 10CC For Phone LED BGA SMD PGA PCB soldering repair.
10cc solder paste with aluminum alloy tube push rod + needle for electronic IC PCB Phone motherboard and small components/circuit board BGA SMD PGA PCB welding repair tool.
Note: Solder paste flux can only be sent out by special post mail.
UP-78A:
- 100% new brand and high quality.
- Good immersion and high intensity joints.
- Easy to peel off with hands or tweezers, leaving no residue.
- Won't oxidating gold, copper, phosphorus, bronze, oxidation.
- Prevent contamination during assembly.
- High soaking ，high strength joints.
- No-toxic, no-corrosive, strong ability of insulation.
- Good insulation and smooth welding surface. No deterioration no dry.
- Suitable for welding mobile phone chips under high temperature operation.
- Solve high rework, black screen of death, unstable performance. Chip soldering problems such as false soldering, virtual soldering, and automatic restart.
- NO-Clean, lead-free, environmental soldering paste flux.
- No residue, no corrosion, prevent metal oxidation good tin.
- Great soldering paste for smartphone, PCB, BGA, SMD rework.
- High-precision circuit board soldering SMT, BGA soldering processes, etc.
- Good solderability, insulation resistance, no spattering and non-corrosive.
- Widely used in adapted to the mobile phone repair industry, computer digital service industries.
Parameters
- Brand: MAANT
- Name: solder paste
- Model number: UP-559
- Paste: Halogen-free white paste
- Capacity: 10g
- Gross weight with shell: 19g
- Size: 95mm x 30mm
Specifications:
- Volume: 10ml/10cc
- Dimension: 93 x 33 x 23mm
- Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
- Color: Yellow
- Insulated: Yes
- With Needle Tip: Yes
- Application: for soldering and reballing of computer and phone chips.
- Advantage: Good immersion and high intensity joint.
- Function: for PCB, BGA, PGA reworking.
- 100%: New Type, high quality.
