MaAnt UP-79 MY-224 MY-225 halogen-free solder paste for mobile phone/electronic circuit board CPU BGA chip soldering desoldering repair. MaAnt 10cc high insulation resistance soldering paste flux for electronic component chip tinning and welding.
Option:
1. MaAant UP-79 10CC.
2. MaAant MY-224-OR 10CC.
3. MaAant MY-225-IM 10CC.
Features:
1. Lead-free and halogen-free BGA solder paste, non-conductive after welding, no need to clean.
2. Suitable for chip tinning, chip detinning, electronic components, BGA tinning, home appliance repair.
3. Needle push rod, plug and play.
4. The welding is firm, does not fall off, anti-oxidation, and has good flow.
5. No false soldering, bright solder joints.
6. No resistance value, non-conductive after welding.
7. No lead, no halogen, environmental protection.
8. No resistance solder paste, maintenance without reworking.
9. Less residue, easy to tin, strong activity, high viscosity, no cleaning.
Parameter:
Name: MaAnt Halogen-free solder paste / BGA solder paste.
Model: UP-79 / MY-224-OR / MY-225-IM.
Type: No lead, no halogen and no resistance.
Paste: Dark yellow / yellow / milky white.
Net weight: 20g/20g/20g.
Gross weight: 26g/26g/26g.
Dimension: 18*18*110mm.
Package List:
1 x Solder paste.
Note: Solder paste can only be shipped through special post.
