JTX Black Champion Tin Paste 138/158/183 Degrees for mobile phone PCB CPU BGA chips soldering repair. JTX Black Champion high/medium/low temperature solder tin paste, no virtual soldering, easy to tin, anti-oxidatio, widely used in mobile phone repair, sensors, wires, motors, fuses, connectors, metal shells, lighting, electronic components, SMT repairs, BGA chip reballing, etc.
Features:
1. Excellent welding effect: no virtual soldering, firm welding; full solder joints, uniform and delicate tin beads.
2. Strong wettability: high resistance activity, and excellent welding performance.
3. Moderate viscosity: good thinness and consistency, patch components are not easy to offset, and solder paste is not easy to agglomerate.
4. No residue: ensuring the cleanliness of the circuit board after welding.
5. Multiple specifications available: with different melting point specifications such as low temperature 138°C, medium temperature 158°C, and high temperature 183°C, which can meet different welding needs.
6. Made of high-quality materials: safe and reliable, ensuring welding quality.
7. New formula and storage-resistant: its antioxidant capacity is at least 2 times higher than that of similar solder pastes.
Product Information:
Model: jtx-183.
Weight: 50g.
Applicable: CPU/chip/hard disk/tail plug, etc.
Characteristics: Tin crawling strong,Bright and full solder joints.
Model: jtx-158.
Weight: 50g.
Suitable for: Double layers motherboard middle layer reballing, etc.
Features: Full tin balls antioxidant, no residue.
Model: jtx-138.
Weight: 50g.
Suitable for: Tinned and desoldering, low-temperature welding.
Characteristics: Tin crawling strong, Bright and full solder joints.
