JC iHeater Desoldering Station Heating Plate For Motherboard Face ID Repair
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JC iHeater Desoldering Station Heating Plate For Motherboard Face ID RepairJC iHeater Desoldering Station Heating Plate For Motherboard Face ID RepairJC iHeater Desoldering Station Heating Plate For MotherboardJC iHeater Desoldering Station Heating Plate For MotherboardJC iHeater Desoldering Station Heating Plate For MotherboardJC iHeater Desoldering Station Heating Plate For MotherboardJC iHeater Desoldering Station Heating Plate For MotherboardJC iHeater Desoldering Station Heating Plate For MotherboardJC iHeater Desoldering Station Heating Plate For MotherboardJC iHeater Desoldering Station Heating Plate For MotherboardJC iHeater Desoldering Station Heating Plate For Motherboard

JC iHeater Desoldering Station Heating Plate For Motherboard Face ID Repair

Save $12.00
PHONEFIXSKU: FX503N
Option: iHeater 3rd 21pcs set(X-16PM)
Voltage: 110V
Price:
$253.99 USD $265.99 USD

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Stock:
In stock

Description

JC iHeater 3rd Gen Heating Desoldering Station for iPhone X-16 Pro Max FACE ID Android Motherboard Repair. 3rd Gen JC Aixun iHeater Full set for iPhone X-16 Pro Max PCB Teardown. AIXUN iHeater Motherboard Preheating Separating Desoldering Tools.

Aixun iHeater 3rd Preheating Platform Newly Added iPhone 16 Series Heating Molds for iPhone 16/16 Plus/16 Pro/16 Pro Max.

JC Aixun iHeater heating platform iPhone X-16 Pro Max set(21pcs molds):
1x JC Aixun iHeater 3rd gen host.
1x iPhone X/XS/XS MAX mold.
1x iPhone 11 mold.
1x iPhone 11 Pro/11 Pro Max mold.
1x iPhone 12/12 Pro mold.
1x iPhone 12 Pro Max mold.
1x iPhone 12 mini mold.
1x iPhone 13 mold.
1x iPhone 13 mini mold.
1x iPhone 13 Pro mold.
1x iPhone 13 Pro Max mold.
1x iPhone 14/14 Plus mold.
1x iPhone 14 Pro/14 Pro Max mold.
1x iPhone 15/15 Plus mold.
1x iPhone 15 Pro/15 Pro Max mold.
1x iPhone 16/16 Plus mold.
1x iPhone 16 Pro/16 Pro Max mold.
1x Android motherboard mold.
1x CPU IC Glue Removal mold.
1x Face ID mold.
1x Screen bracket mold.
1x iPhone X-12 Pro Max rear camera mold.

Features:
1. Intelligent temperature control.
2. Protect the mainboard.
3. Soldering and Desoldering.
4. 70-260°C safety adjustable, digital tube display, dual-button design.
5. Adopting integrated design of soldering and desoldering.
6. Disassemble and separate the mainboard.

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