iRepair MS1 Soldering Pre-heating Station For iPhone X-16 Pro Max

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PHONEFIXSKU: iRepair-MS1

Option: MS1 X-16PM Full Set
Price:
Sale price$89.99 USD Regular price$116.99 USD

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Stock:
In stock

Description

Mijing iRepair MS1 desoldering preheating platform for iPhone X-16 Pro Max motherboard CPU IC heating disassembly and glue removal. iRepair MS1 Soldering heating Station MS1-14/15 module for iPhone 14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max/16/16 Plus/16 Pro/16 Pro Max.

New MS1-Camera-A/B/C/D/E Camera Module For iPhone 7-15 Pro Max. MS1-14/15 module for iPhone 14-15 series. iRepair MS1 desoldering preheating platform for iPhone X-16 Pro Max motherboard CPU IC Dot matrix Face ID heating disassembly and glue removal.

PPD120ES Desoldering Preheating Platform For iPhone X-14 Pro Max module universal module + dot matrix module + follow-up unlimited upgrades.

Mijing MS1 Camera Module  For iPhone 7-15 Pro Max:
-A: for iPhone 7/7P/8/8P/X/XR/XS/XS Max/11/11 Pro/11 Pro Max camera.
-B: for iPhone 12/12MiniI/12Pro/12 Pro Max/13/13 Mini/13 Pro/13 Pro Max camera.
-C: for iPhone 14/14 Plus/14 Pro/14 Pro Max Rear camera heating module.
-D: for iPhone 15/15 Plus/15 Pro Rear camera heating module.
-E: for iPhone 15 Pro Max Rear camera heating module.

 
Features:

  1. iRepair MS1 pre-heating station for iPhone X/XS/XS Max/11/11Pro/11 Pro Max/12/12 mini/12Pro/12 Pro Max/13/13mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max /16/16 Plus/16 Pro/16 Pro Max motherboard soldering separating. 
  2. Newly upgraded heating element, fast heating, precise temperature control.
  3. Added countdown function, layering and fitting are more secure.
  4. iPhone X -14 Pro Max module + universal module + dot matrix module + follow-up unlimited upgrades.
  5. Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep, 183° three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.


Parameters:
Brand: Mijing iRepair
Name: iRepair MS1 Multifunctional Desoldering Station
Packing size: 220*158*50 (mm)
MS1 upgrade expansion module
Packing size: 114*79*10 (mm)

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