CPU Nand WiFi Chip Glue Remove Liquid Cleaner BGA IC Adhesive Remove Liquid Adhesive Epoxy Remover, High effect BGA IC Adhesive Glue Removing Epoxy Remover Cell Phone BGA-IC Repair Remove Liquid Phone Repair Tool 250ml.
Please note: Liquids are only can be sent out by special post mail.
Feature: 250ml BGA IC glue epoxy remover. Soften & remove resinating and sealing glue of chip BGA IC of mobile phones easily. Quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc. It won't do harm to your circuit board and components. Environment friendly and safe.
