Amaoe MQ1 MQ2 MQ3 MQ4 MQ5 MQ6 reballing stencil for Qualcomm MTK CPU RAM soldering repair. 0.12MM High quanlity CPU RAM BGA reballing Solder template stencil for SDM710 /SDM845 /SDM660/SDM636 MT6771V/MT6739V/MT6763V/MT6757V.
Amaoe MQ:1 MQ:2 MQ:3 MQ:4 MQ:5 MQ:6 For MTK Chip CPU BGA Stencil MT6771V SDM845 SDM710 MT6739V MT6757V SDM660 IC Solder Reballing Tin Pin Heating Template.
Features:
1. Deformation resistant material.
2. Precise pins location.
3. Square round hole.
Option:
MQ:1 stencil: For Qualcomm MTK MT6771V, SDM845 B, SDM710, MT6739V, MT6757V, SDM845 A, SDM660, MT6763V.
MQ:2 stencil: For Qualcomm MTK MSM8909W RAM, MT6761V, MT6779V, MT6758V, MSM8909W CPU, SDM439, MT6765V, MT6768V.
MQ:3 stencil: For Qualcomm MTK SM8250 RAM, MT6885Z RAM, Snapdragon 865, SM7150, SM8250 CPU, MT6885Z CPU, SM6125, SM7150.
MQ:4 stencil: For SM8350, SM8450, SM7315, SM7325, MT6833V, MT6799W, MT6877V, RAM CPU IC Chip.
MQ:5 stencil: For MT6895Z/8795Z, MT6983Z, MT8176V, SM8475, SM6225, SM7450, SM8550, RAM496.
MQ:6 stencil: For Snapdragon 6Gen1 SM6450, Snapdragon 8Gen3 SM8650, Dimensity 9200-MT6985W, MT6781V, Snapdragon 4Gen2 SM4450, Dimensity 1050-MT6879V,
BGA496, MT8781V.
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