Amaoe BGA Reballing Stencil For SAMSUNG Exynos EU1 EU2 EU3

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PHONEFIXSKU: VZ274

Option: EU1 0.12mm
Price:
Sale price$1.99 USD Regular price$2.99 USD

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Stock:
In stock

Description

Amaoe For Samsung Exynos CPU RAM IC EU1 EU2 EU3 EU4 EU5 BGA Stencil Chip Solder Ball Reballing Pins Tin Plant Net Square Hole. 

Exynos 7885/9820/980/8890/5430/7420/7880/8895/9810/3475/7580/3470/7570 For Samsung CPU BGA TIN Reballing Stencil Solder Template.

Features:
1. Brand New.
Amaoe BGA Reballing Stencil For SAMSUNG Exynos EU1 EU2 EU3 EU4 EU5 
Advantage:
1. Deformation resistant material
2. Precise pins locatio
3. Square round hole

Option:
option 1: Exynos CPU-EU1 0.12mm
option 2: Exynos CPU-EU2 0.12mm
option 3: Exynos CPU-EU3 0.12mm
option 4: Exynos CPU-EU4 0.12mm
option 5: Exynos CPU-EU4 0.15mm
option 6: Exynos CPU-EU5 0.12mm

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