Amaoe BGA Reballing Stencil For HI6250 HI3690 CPU 5G

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PHONEFIXSKU: VZ269

Option: HI6250
Price:
Sale price$2.55 USD Regular price$2.90 USD

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Stock:
In stock

Description

AMAOE For  CPU RAM HI6250  HI6260 V101 HI3650 HI3660 HI3690 4G 5G HI3680 HI3670 BGA Reballing Stencil IC CHIP Template.

HI3690 4G 5G CPU HI3690/3680/3670 RAM BGA Stencil Reballing IC Pin Solder Tin Plant Net Heating Template 0.12mm Thickness.

Option:
option 1: HI6250
option 2: HI6260 V101
option 3: HI3630/3635 CPU
option 4: HI3650 RAM
option 5: HI3650 CPU
option 6: HI3660 CPU
option 7: HI3660 RAM
option 8: Hi3690/80/70 RAM
option 9: HI3690 CPU 4G
option 10: HI3690 CPU 5G

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