RELIFE RL-601MA 9 in 1 Universal CPU Reballing Stencil Platform iPhone CPU Lower Layer Tin Planting Platform Set For A8-A16 iPhone 6~14 Pro Max IC Chip Planting Tin Template Fixture, Universal CPU Reballing Stencil Platform RL-601MA for iPhone 6 to 14Pro Max A8/A9/A10/A12/A13/A14/A15/A16 IC Chip Planting Tin Template Fix.
Features: iPhone CPU tin planting platform set suitable for A8/A9/A10/A11/A12/A13/A14/A15/A16 CPU. Round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls. Automatic and precise alignment / Universal chip slot structure / Integration of positioning / Glue removal / Tin planting. Using a new type of magnetic power original positioning, strong magnetic automatic clamping, convenient and flexible, support for a variety of CPU maintenance positioning, stable and reliable clamping. Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetic unchanged. General more IC clamps such as chip CPU/hard disk/font library; place the chip fixedly in the upper left corner of the chip slot (let the magnetic suction module automatically withstand the edge of the chip, which can cover the corresponding chip tin-planting steel stencil.
Skip to content