XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone A8-A16 Qualcomm MTK Hisilicon CPU tin planting. XZZ L23 BGA Reballing Stencil Platform for iPhone 6 to 14 Pro Max A8 A9 A10 A12 A13 A14 A15 A16, Qualcomm, MTK, Hisilicon CPU IC soldering repair.
Features:
- Magnetic power positioning with strong magnetic force and automatic alignment.
- Built-in powerful magnets with strong adsorption for easy pick up and fast maintenance.
- Easy to operate stable clamping, with automatic clamping and flexible full pull.
- Synthetic stone base that is green and environmentally friendly with high-temperature resistance, high strength, dirt resistance and easy to clean.
- Tin-plating table with environmentally friendly rubber feet that are wear-resistant, anti-skid, shock absorbent, anti-pressure, anti-aging, non-toxic, tasteless, and high-temperature resistant.
- Imported alloy steel that provides metal fatigue resistance, making the product more durable.
- Precise alignment that ensures the accuracy of the solder joints.
- Square holes and rounded corners for planting tin and black nets to make each tin ball more rounded and fuller.
- Rigid and flexible with the ability to maintain the flexibility of the steel and easily restore it to its original shape.
- High precision with no burrs and every mesh of the same size, ensuring that they do not stick.
- Double magnet with super magnetic force and accurate positioning without shaking.
Support Model:
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Qualcomm: 765G, 778G, 845, 855, 865/870, 888/888 Plus, 8 Gen1, 8+ Gen1, 8 Gen2
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MTK: 720, 800, 810, 900, 1000, 1100, 9000, 9200
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Hisilicon: 710, 960, 970, 810, 980, 820/985, 990, 9000
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iPhone: A8, A9, A10, A11, A12, A13, A14, A15, A16
Package includes:
- 1 x Tin Planting Platform
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