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Repairing the iPhone logic board using a heated platform
Repairing the iPhone logic board using a heated platform involves several key steps and temperature settings to ensure an effective and safe repair.Gather the necessary tools:
- Motherboard desoldering and soldering station
- Midframe ball placement platform
- Motherboard functional test fixture
- Tweezers
- Engraving knife
- Hot air gun
- Soldering iron
- Solder paste
Main steps:
- Heating the motherboard: Place the motherboard on the heated platform and set the temperature to about 150°C (302°F). This temperature is essential to melt the solder between the layers of the motherboard without damaging the components.
- Separation process: After the solder is melted, use the engraving knife to gently lift the upper layer of the motherboard with tweezers. This step requires precision to avoid damaging any components.
- Removing residual solder: After separating the layers, use a soldering iron and solder wick to clean the pads on both layers to remove any residual solder. This ensures a good connection when reassembling.
- Functional testing: Before reassembly, use a test fixture to check the functionality of each layer to ensure they can start properly.
- Reballing: Use a Reballing Platform to apply new solder balls to the pads on the signal board. Care must be taken to prevent excess solder from flowing into unwanted areas.
- Reassembly: Carefully align the two layers and apply heat (about 130°C) to melt the solder balls and bond the layers together, ensuring there are no gaps or misalignments in the process.
Important notes:
- Temperature control: Maintaining the proper temperature is critical; overheating can warp components or cause poor soldering.
- Use of flux: Applying flux before soldering helps improve solder paste flow and ensure better connections between pads.
- Risks of improper heating: Using improper heating methods (such as a heat gun without precise control) can cause damage. For example, heating for too long can adversely affect nearby components.
Repairing the iPhone logic board with a heating platform requires careful heating to separate and reassemble the board layers. This method is essential for solving problems such as solder joint failure. The process usually requires setting the heating platform to around 150°C to 155°C to ensure that the solder melts without damaging the components. Let's watch the video together below: Aixun iHeater Pro Desoldering Station | iPhone Logic Board Repair Tool (Tips and Tricks #16).
Commonly used heating platforms:
1. XZZ L2023 Intelligent Desoldering Station
XZZ L2023 preheating desoldering station is an upgraded version of the Xinzhizao X360II preheating station. XZZ L2023 intelligent desoldering station motherboard layered heating platform PCB separation installation tool is suitable for iPhone Huawei Samsung Oppo Xiaomi Redmi VIVO OnePlus Nubia IQOO ROG, etc.
2. Mechanic IX5 Ultra Preheating Platform
Mechanic IX5 Ultra Universal Preheating Platform for iPhone X-15 Pro Max motherboard delamination, bonding, dot matrix repair, degumming, etc.
