Before starting, we need to prepare the repair tools:
- Motherboard Desoldering and Soldering Station
- Midframe Ball Planting Platform
- Motherboard Functional Test Fixture
- Tweezers
- Engraving Knife
- Hot Air Gun
- Soldering Iron
- Solder Paste
Main Steps:
1. Place the motherboard on a Heating Platform with the temperature set to around 150°C to melt the solder between the layers.2. After the solder is melted, use the engraving knife to gently lift the upper layer with tweezers
3. Cleaning: Use a soldering iron and wick to clean the pads on both layers to remove residual solder. This step is essential to ensure a good connection when reassembling.
4. Test functionality: After cleaning, use a test fixture to check the functionality of each layer to ensure they can start properly before reassembly.
5. Reball: Use a reballing platform to apply new solder balls to the pads on the signal board, ensuring that excess solder does not flow into unwanted areas.
6. Reassembly: Carefully align the two layers and apply heat (about 130°C) to melt the solder balls and bond the layers together. Make sure there are no gaps or misalignments during this process.
Important Notes:
1. Temperature control: Maintaining the proper temperature is critical; overheating can deform components or cause poor soldering.2. Use of flux: Applying flux before soldering helps improve Solder Paste flow and ensure better connections between pads.