QianLi IBlack 3D CPU BGA Reballing Stencils For iPhone X 8 7 6S 6 5S

QianLi ToolPlus iBlack 3D BGA reballing stencils template net for iPhone 5S 6 6S 7 8 X power logic module, QianLi iBlack black 3D BGA reballing stencils for iPhone CPU motherboard BGA reballing soldering repair tool, QianLi iPhone power logic module, 3D Black BGA reballing stencils kit for iPhone X 8 7 6S 6 5S communication baseband module tin planting net.

Qianli Black BGA reballing stencil is temporarily unavailable, replacement:     WL Black Stencil Or MJ 3D stencil.


Qianli ToolPlus iBlack 3D BGA Reballing Stencil Template for iPhone 5S 6 6S 7 8 X Power Logic Module

[ Optional Types ] :

• Option 1: 5S Q3
• Option 2: 6 BMW730
• Option 3: 6S BMW760
• Option 4: 7 BMW330
• Option 5: 8/X S400

Product Features :

• Color : Black
• Feature : Square Hole

1. High quality stainless steel plate board.
2. Specially designed for iPhone 5S 6 6S 7 8 X communication bandbase module.
3. Make your repair work easier.
4. The black shade allows for contrast with the pads giving you the ability to line up pads perfectly.
5. In this set you get the stencils for iPhone 6S and iPhone 6S Plus.
6. The black edition stencils prevent glare from the LED light on the scope, and reduce headaches and fatigue from long exposure while working.

Note :

1. We promised all the plate boards are in brand new condition, but this item is easy to get scratched.
2. There may be some scratches and fingerprint on the surface, please make sure you do not care, thanks.
3. Size we measured may have 1~3mm error, please make sure you do not care.

Package List :

• 1pcs x 3D BGA Reballing Stencils