MaAnt Comprehensive BGA Reballing Stencil for iPhone 6-16 Pro Max motherboard CPU NAND IC Tin Planting Soldering Repair. MaAnt 0.12mm square hole steel mesh reballing stencil for iPhone 6-16 Pro Max A8-A18 Pro CPU Nand WIFI and other chips.
Features:
- The strong steel is not easy to deform at high temperature.
- Square hole fillet design, high precision, burr-free, no tin jam up.
- Keep the flexibility of steel for a long time, normal deformation and bending, and easy to restore immediately.
- Accurate alignment, good flexibility, durability, and high-temperature resistance give you a different tin planting experience.
- The tin ball is full and round, square hole chamfered tin planting black net makes every tin ball of you rounder and fuller.
- Imported alloy steel with good high-temperature resistance and metal fatigue resistance, making the service life of the product more lasting.
- Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned.
- For iPhone 6/6 Plus/6S/6S Plus/7/7 Plus/8/8 Plus/X/XS/XS Max/XR/11/11 Pro/11 Pro Max/12/12 Mini/12 Pro Max/13/13 Mini/13 Pro Max/ 14/ 14 Plus/14 Pro/14 Pro Max/15/15 Plus/15 Pro/15 Pro Max/16/16 Plus/16 Pro/16 Pro Max.
