Amaoe IP16 A18 BGA Reballing Stencil for iPhone 16/16 Plus/16 Pro/16 Pro Max motherboard CPU/font/audio/power IC /USB control IC and iPhone 16 middle layer soldering repairs. High quality BGA reballing stencil comprehensive steel mesh for iPhone 16/16 Pro Max middle layer frame/motherboard chip soldering.
Option:
1. Amaoe IP16 A18 Reballing Stencil (test version): comprehensive reballing stencil for iPhone 16/16 Plus/16 Pro/16 Pro Max.
2. Amaoe IP16 PL-012 reballing stencil (test version): for iPhone 16/16 Plus middle layer frame soldering.
3. Amaoe IP16 reballing stencil (test version): for iPhone 16 Pro/16 Pro Max middle layer frame soldering.
Please note that the iPhone 16 series reballing stencil is currently only a test version and will be modified based on the actual motherboard situation.
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