Mijing KC8 Quicky Glue Removal Blade Set CPU Disassemble Knife

Save $3.80
PHONEFIXSKU: MJKC8

Size: Mijing KC8
Price:
Sale price$11.99 USD Regular price$15.79 USD

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Stock:
In stock

Description

Mijing KC8 multi-function Quick Release Knife for Mobile Phone Motherboard Glue Removal. MIJING KC8 Maintenance Knife Handle Blade Set IC Remove Glue Rework Blade CPU Disassemble Knife,Supports quick replacement blades. Qianli MEGA-IDEA BXL01 Blade DIY Maintenance Knife for Phone Motherboard IC Chip Pry Glue Cuting Removal

Features:
  • Press the rebound structure, quickly remove the blade.
  • Multi-functional glue removal knife, high-temperature resistance, corrosion resistance, high hardness, high toughness, fine high carbon elastic steel, pure hand polished.
  • A variety of options to provide you with solutions to all kinds of maintenance problems, cutting black glue, side glue removal, motherboard glue removal, prying hard disk, etc.
  • Pure hand polishing, surface vacuum plating process, with strong corrosion resistance and high-temperature durability, and wear resistance.
  • New blade design, rigid and flexible, with strength, more toughness
  • Fine high-carbon elastic steel blade grinding, toughness, rebound does not deform.
  • Comfortable grip, with a universal ergonomic knife handle.
  • Each piece of blade material is laser cut to ensure a high degree of product uniformity.
Package includes:
1 x Handle
8 x Blades

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