MECHANIC FXS-9/ FX-9 0.02mm jumper wire for iPhone fingerprint repair / PCB BGA sodering point. 0.01 0.02mm Jump Wire for iPhone Motherboard Chip 99.6% Insulated Fingerprint Flying Soldering Repairing Copper Conductor, iPhone Chip Conductor Wire for PCB BGA Sodering Point, Ensure There is no Short-Circuit Between 0.1mm Solder Joints, Totally Beat Handset Cable.
Product Features:
- MECHANIC FXS-9/ FX-9 0.02mm jumper wire for iPhone fingerprint repair / PCB BGA sodering point.
- Special material: Pure copper wire line with conductive surface.
- 0.02 mm super precision diametaer, portable, easy to be straightened.
- Insulated Jumper wire to avoid shorting with other components.
- 0.01mm thin and 200m in length jumper wire .
- Super compacity: for Elevtronics, iPhone and Android cellphone logic board repair.
- Good toughness, not easy to break.
- Ideal for running jumpers on circuit board.
Product Specification
- Diameter: 0.01mm/0,02mm.
- Length:200m.
- Material: 99.6% Copper.
- Application: for iPhone motherboard PAB,BGA soldering repaing jump wire.
- Solder Joint Spacing: 0.1mm.
- Ultra-fine 6-generation fingerprint chip jumper copper line.
[ Option ]
- FX-9: Non insulated Jump Wire.
- FXS-9: Insulation Type (insulated) Jump Wire.
- 0.01mm Insulated Jump Wire.
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