High purity rosin core solder wire for mobile phone electronic components welding repair, 50g 0.3/0.5/0.8/1.0mm rosin soldering wire for phone BGA motherboard repair, No-cleaning melt rosin core solder welding flux 2.0% iron soldering wire for mobile phone electronic components welding repair.
PHONEFIX 50g Solder Wire 2% Flux / High Purity Rosin Core / Low Melting Point for Phone Wiring RepairSpecification :
- Materials: Tin and lead
- Weight: 50g
- Wire Diameter: 0.3/0.5/0.8/1.0mm
- Flux Content: 2.0(%)
- Melting Point: about 290(°C)
- Type: Rosin Core Solder Wire
- Shape: Small roll type
- Uses: electronic components Welding repair
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