Mechanic G100 repair paste for mobile phone motherboard double-layer dropped solder joints repair without disassembly. Mechanic G100 20ml lead-free flux paste drop points non-dismantling repair paste, fast curing and quick repair of dropped points.
Features:
1. Mechanic G100 Non-removal drop point repair paste is environmentally friendly and lead-free, no need to clean and have little residue, no need for additional push rod assistance, a good helper for repairing drop points.
2. Lead-free and environmentally friendly formula, ROHS compliant, safe to use.
3. Non-disassembly repair: effective repair can be carried out without disassembling components, especially double-layer PCB.
4. Fast curing, fast repair of drop points, environmentally friendly materials, excellent wettability.
5. The lid has a built-in anti-blocking rod, and the plug rod can prevent the repair paste from hardening and blocking the outlet.
6. It can be used for auxiliary and enhanced welding of chip pads that are not easy to absorb solder after chip glue removal, fingerprint jump wire, battery seat, tail plug charging socket, inline seat amplifier type chip, external pin chip, untinned circuit board, etc.
7. Suitable for chip pin repair, mobile phone tail plug repair, motherboard screw column repair, motherboard internal connection seat repair.
Product Parameters:
Model: Mechanic G100 Non-Dismantling Drop Point Repair Paste.
Capacity: 20ml.
Low Melting Point: Up to 220℃.
Product Size: 135×30×20mm.
Package Size: 137×23×23mm.
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