Lead-Free BGA Solder Flux Paste 138℃ 183℃ 217℃ Low Medium High Temperature Soldering Paste Flux for Mobile Phone Motherboard Welding Repair Tool.
Lead-Free:
1: Low Temperature (138℃):
Sn42 / Bi58
Power Size: 25-45μm
2: Medium Temperature (183℃):
Sn64 / Bi35 / Ag1
3: High Temperature (217℃):
Sn96.5 / Ag3 / Cu0.5
Power Size: 20-38μm
Leaded:
Medium Temperature (183℃):
Sn63 / Pb36.5 / Ag0.5 4
Power Size: 20-38μm
Peculiarities:
- With strong continuous printing performance, it is suitable for fine pitch IC, BGA and relatively nice component soldering.
- Wettability and demould properties are good, anti-cold & hot collapse and anti-dry are strong.
- Applicable to a variety of high-demand materials PCB welding, nice pitch and high-precision components and few tin-connection tombstoning displacement phenomenon.
- Full tin and shinning tin beads, less residue, white and transparent, and there is no strong corrosive substance such as fluorine.
Package includes: 1pc x Lead-Free BGA Solder Flux Paste
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