AMTECH NC-559-ASM 10cc/30cc no-clean solder paste for cell phone PCB BGA soldering repair tools. Original NC-559-ASM lead-free solder paste flux for mobile phone BGA reballing, lead free solder paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.
Note: solder paste can only can be sent out by special mail post.
Description:
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing. The Lead Free Solder Paste had transparent residue and low solder ball rate, and excellent wetting ability on PCB.
Features:
- Excellent capacity of solder-stickiness
- Excellent Anti-wet Capacity
- Widely used on BGA, PGA, CSP packages and flip chip operation
- Suitable for multiple PCB reflow
- No-clean and Lead free for environmental protection
Specification:
- Brand: AMTECH
- Flux Type: NC-559-ASM
- Volume: 10cc/30cc / bottle
- Color: Yellow
- Weight: 0.08kg
Package includes:
- 1pc x NC-559-ASM Solder Flux Solder Paste
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