Multiple Models: Suitable for iPhone 13/13Pro /13Pro Max /13Mini, innovative single-sided. 4 models universal to meet your maintenance needs.
Silicone non-slip foot pads, specific weighted iron plate at the bottom Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid and anti-scald, so that the tin planting position is more stable.
Stencils with no bulge under high temperature: 4 in 1 Middle frame reballing platform Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge iPhone 13/13Pro /13Pro Max /13Mini.
User's Guide Shows:
Step 1: Install the motherboard. Put the lower layer of motherboard that needs reballing to the corresponding positioning pins. Place it in the synthetic stone base.
Step 2: Install stencils
Align the stencils of the corresponding model with the positioning pins and put it into the base.
Step 3: Apply solder paste Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste.
Step 4: Heat evenly Combine the top cover of the product with the base and operate. Use the hot air gun to heat the corresponding reballing hole.
1 x 4 in 1 Middle frame reballing platform