PPD120 Pre-Heating Platform for Iphone Motherboard De-soldering

5 kinds: 110V / 220V Mini PPD 120CXE 120CX 120CC 120CQ 120C Phone PCB pre-Heating Rework Station.

Option 1: PPD 120CXE for iPhone X CPU Desoldering pre-Heating Rework Station.

PPD 120CXE Mini Intelligent Desoldering Rework Station for Remove Welding iPhone X CPU Repair. No need the hot Air Rework station, working on 230℃, professional iPhone PCB repair tool and special designed for iPhone X CPU Disassembly and Welding Repair.

Option 2: PPD 120CX for iPhone CPU Glue Remove and iPhone X upper / lower logic board Disassembly and Welding Repair.

PPD 120CX Mini Intelligent Desoldering Demolition Rework Station Heater for iPhone X Middle Frame Layer Board Separate CPU Glue Remove. No need the hot Air Rework station, working on 230℃, Separate the iPhone X upper / lower logic board by PPD120cX Pre-heating Rework Station.

Option 3: PPD 120CC for Android phones motherboard Desoldering pre-Heating Rework Station

PPD 120CC Mini Intelligent Welding Platform Desoldering Rework Station Heater for Android Phone PCB Repair. No need the hot Air Rework station, working on 230℃, professional tool and special design for Android phones

Option 4: PPD 120CQ for iPhone CPU Glue Remove and Desoldering Rework Station

PPD 120CQ pre-Heating Rework Station for iPhone A8 A9 A10 A11 CPU Disassembly and Welding Repair. No need the hot Air Rework station, working on 230℃,it is the Desoldering Rework Station tool only for iPhone A8 A9 A10 A11 CPU.

Option 5: PPD 120C for iPhone 5 6 7 motherboard Desoldering Rework Station and iphone A8 A9 A10 A11 Disassembly and Welding Repair

PPD 120C pre-Heating Rework Station for iPhone A8 A9 A10 A11 CPU NAND IC BGA Mini Intelligent Demolition Welding Platform Low Temperature Demolition Rework Station. No need the hot Air Rework station, working on 230℃, it is the Desoldering Rework Station tool for iPhone A8 A9 A10 A11 CPU NAND IC BGA and so on.

Features : 

• 100% brand new, high quality
• Voltage: 110V / 220V in one
• Demolition shield temperature adjustment 180℃-220℃
• In addition to CPU side glue temperature 180℃-220℃
• Demolition A8 A9 A10 A11CPU the temperature 230℃-240℃
• Desmearing temperature 180℃-200℃
• Reball BGA chip temperature 180℃-200℃
• Soldering A8 A9 A10 A11 CPU temperature 190℃-210℃