AMAOE RK1 RK2 RK3 RK4 Rockchip Chip Reballing Stencil Tin Planting Steel Mesh for RV1108A RK3399 RV1109 BGA96 BGA153 RK3218 RK1808 RV1126-1109 RK3568 DDR4 BGA200 PX30 NPX3205 RK3568B2 X2600 ADS1294R, etc. Chip soldering planting tin net square hole heating mesh.
Option:
1. Amaoe RK:1 0.2MM BGA Reballing Stencil: rockchip chip series - dedicated for tablets/face recognition/live broadcast machines/artificial intelligence devices, for RV110BA RK3399 RV1109 BGA153 BGA96.
2. Amaoe RK:2 0.20MM BGA Reballing Stencil: for RK3128 RK1808 RV1126-1109 RK3568 RK3399.
3. Amaoe RK:3 0.20MM BGA Reballing Stencil: for LPDDR4 BGA200, DDR4, RK3308H, PX30, RK3568B2, NXP3250 LP3250FET296, LPDDR4 BCA200, DDR4, OV00426.
4. Amaoe RK:4 BGA Reballing Stencil: for BGA153 BGA200 ADS1294R RK3308H PX30 X2600 BGA200.
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