RELIFE TF1 Mini and Relife TF2 Plus tempered heat-insulating glass motherboard chip fixture for mobile phone/iPad/tablet repair. RELIFE TF1 Mini insulated glass clamp for mobile phone PCB board and BGA CPU chip glue removal. RELIFE TF2 Plus motherboard insulated tempered glass holder fixture for Phone motherboard soldering repair.
RELIFE TF1 Mini Chip Glass Fixture for Mobile Phone Repair Features:
Precise and Secure Clamping: The inward bevel design offers enhanced stability, firmly holding motherboards in place to prevent slippage during maintenance.
High Temperature Resistance: Constructed with high-strength tempered glass, it withstands temperatures up to 500°C without deforming, ensuring durability for long-term use.
Strong Compatibility: Features two-way movement, making it compatible with a wide range of chip and motherboard types.
Easy to Clean: The glass panel is resistant to corrosion, allowing for simple wipe-clean maintenance and preserving the tool’s pristine condition.
Compact and Lightweight: Measuring 815024mm and weighing approximately 142g, it is easily portable and suitable for various mobile phone motherboards.
Quality Silicone Protection: Equipped with a high-quality silicone sleeve to protect your hands from heat and enhance grip during operation.
Classic Design: Inspired by the iconic Tetris style, combining creativity and nostalgia, adding a unique touch to your repair toolkit.
Product Parameters:
Model: TF1 Mini
Product Size: 815024mm
Packing Size: 1087735.5mm
Net Weight: 142g
Gross Weight: 184g
TF2 Plus Motherboard Glass Fixture for Mobile Phone Repair Features:
Precise Clamping: Inward bevel design ensures a firm grip on motherboards, effectively preventing heat loss during repairs.
High Compatibility: Dual-direction movement allows compatibility with various chipsets, CPUs, and hard drives, supporting diverse repair needs.
High Temperature Resistance: Made from toughened glass, it withstands temperatures up to 500°C without deforming.
Easy to Clean: The glass surface is corrosion-resistant and can be easily wiped clean for hassle-free maintenance.
Compact and Portable: Lightweight design makes it suitable for various mobile motherboard repairs, ensuring easy handling.
Smooth Operation: Glide rail movement allows for precise positioning without obstruction, ensuring reliable clamping for chip and motherboard applications.
Product Parameters:
Model: TF2 Plus
Product Size: 153mm x 90mm x 23mm
Packing Size: 180mm x 115mm x 35mm
Net Weight: 323g
Gross Weight: 408g
The TF1 Mini is a compact fixture designed for chip handling, providing precise clamping for various mobile motherboards. The TF2 Plus is specifically engineered for mainboard repairs, offering enhanced compatibility and secure clamping for a wide range of chip types. Both fixtures feature high-temperature resistant glass, ensuring durability and reliability during maintenance tasks.
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