JTX JP-1 300W Universal Preheating Platform for mobile phone/iPhone motherboard layering, lamination, reballing tinning, and glue removal repair. JTX JP-1 heating station is suitable for mobile phone PCB repair, circuit board CPU chip reballing, BGA chip and FPC connector socket and other precision parts disassembly and assembly.
Features:
1. Universal heating platform is suitable for mobile phone motherboard layering, lamination, tinning, and glue removal repair.
2. Improve efficiency, precise heating, suitable for mobile phone motherboards of various sizes
3. Heating plate is made of aviation aluminum, which can conduct heat quickly and is durable, which helps the device to have uniform heat distribution and a longer service life.
4. LED digital display thermostat with precise temperature control, which can be easily operated by preset temperature.
5. Maximum power 300Wg, wide voltage frequency conversion adaptation, supporting both 110V and 220V, and faster heating.
6. Enhanced heating area: With the help of the extended heating panel, it supports more motherboard sizes.
Parameters:
Name: JTX JP-1 Preheater.
Heating power: 300W.
Gross weight: about 635g.
Heating table: 102.2*70.2mm.
Temperature control range: 30-265°C.
Usage temperature recommendations:
200-300°C: BGA ball planting.
200-250C: LED lamp bead welding, repair.
180-220C: Motherboard layering and bonding.
150-200°C: Electronic circuit board rework preheating.
80-150°C: Box outer packaging film sealing.
80-120°C: Melting glue, mobile phone screen removal, frame removal.
30-100°C: Heating of laboratory reagents
30°C: Medical tests, bacterial culture, liquid heating.
