PHONEFIX 18pcs phone BGA reballing stencil tool kit 0.3/ 0.35/ 0.5/ 0.55/ 0.6/ 0.76mm, universal BGA reballing rework net directly heating template for phone motherboard repair tool, GA reballing stencil template 0.3-0.76mm for cell phone / laptop repair soldering accessories.
18pcs BGA Reballing Stencil Template Universal Directly Heat: 0.3/ 0.35/ 0.5/ 0.55/ 0.6/ 0.76mm
These stencils were made by high quality steel , can be heated directly by the hot air gun, it is easy and quickly for reballing the BGA IC.
Features :
- 18 stencils are in different sizes, suitable for chips in different sizes.
- Can be directly heated.
- Useful and economical accessories for BGA soldering.
- Durable in use.
Suitable for solder balls: 0.25mm, 0.3mm, 0.35mm, 0.5mm, 0.55mm, 0.6mm, 0.76mm, 1.00mm.....Package List :
- 18pcs x BGA reballing stencil tool
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