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MECHANIC iBGA 13 Middle Layer Motherboard Reballing Kit For iPhone 13 mini pro max Template Soldering Platform With Stencil, 4 in 1 BGA Reballing Stencil Platform Motherboard Middle Rework Tin Mesh Template for iPhone 13/13 Pro/13 Pro Max/ 12 mini.
Features: 1. Anti-leakage tin barrier design. 2. High temperature does not allow the drum. 3. Strong magnetic automatic positioning, precision positioning. 4. Integrated, removable tin planting. 5. Positioning slot of the double-sided motherboard. 6. For iPhone 13/13mini/13 Pro/13 Pro Max.
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