YCS Tin-planted ARC Pad Silicone Mat with 0.4mm 0.5mm 0.8mm 0.3mm 0.45mm 0.77mm Chip Slot for mobile phone Hard Disk CPU BGA Chip Soldering Repair. No bubbling, high temperature resistance, strong magnetic tin pad, easy to adsorb tin planting net BGA stencil. YCS S-550A High-temperature Insulation Pad.
Option:
1. YCS ARC blue pad (0.4mm 0.5mm 0.8mm).
2. YCS Orange pad (0.3mm 0.45mm 0.77mm).
3. YCS S-550A pad.
YCS Arc Pad Features:
1. YCS ARC Pad planting tin silicone mat with 0.4mm 0.5mm 0.8mm 0.3mm 0.45mm 0.77mm slot for mobile phone motherboard CPU NAND Chip BGA reballing soldering repair.
2. Three chip slots in multiple grids meet the tinning of chips of various thicknesses and specifications, and multiple slots are widely used.
3. The strong magnetic adsorption steel mesh will not fall off even if it is thrown wildly. The strong magnetic design makes the steel mesh not easy to fall off and shift, and the tinning is more firm and stable.
4. The heat dissipation holes on the back design prevent the steel mesh from bulging during tinning. The heat dissipation holes design prevents the steel mesh from bulging during tinning, and the strong magnetic adsorption steel mesh is also not easy to shift.
Arc Pad Parameters:
Function: Steel mesh chip tinning pad
Name: YCS repair home tinning steel arc pad
Product size: 117*86*96mm
Net weight: 86g
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