WYLIE Aviation Thermal Insulation Pad for protecting mobile phones, tablets, laptops, and electronic equipment from overheating during motherboard welding repair, screen IC swaps, component replacement, etc.
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Wylie Heat Insulation Pad is used to dissipate heat during soldering repairs and to protect the surrounding components from damage. A high thermal conductivity coefficient and high-temperature resistance make this insulation pad ideal for repairs to mobile phone motherboards.
Features:
1. Excellent Thermal Conductivity: The insulation pad provides superior thermal conductivity to dissipate heat rapidly during motherboard repairs and chip swaps or replacements to prevent component overheating.
2. Ensuring the Safety of Surrounding Components: This insulation pad protects surrounding components from high temperatures during the repair process.
600℃ (Max.) Temperature Resistance: Withstanding temperatures of up to 600 °C, it is particularly useful for almost all repair environments.
3. Thermal Conductivity Coefficient: An excellent thermal conductivity coefficient of 0.012 indicates the material's ability to conduct heat.
Brand: WYLIE.
Product Name: Aviation Heat Insulation Pad.
Temperature Resistance (Max.): 600 °C.
Thermal Conductivity Coefficient: 0.012.
Package Size: 5*5 CM.
Quantity (Per Pack): 5PCs.
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