LUOWEI LW-PT03 LW-PT02 CPU Chip Tin Planting Platform with Heat-resistant Silicone Pad for Electronics/Mobile Phone BGA Chips Soldering Repair. Anti-slip, no bulging, high temperature resistant. Luowei multi-function BGA reballing magnetic platform has zero error positioning and expandable base, suitable for chips with thickness less than 0.9mm and double-layer components.
Features:
1. Versatility: supports a wide range of applications, including welding and chip placement, suitable for CPU, mid-range, hard disk, and BGA chips welding.
2. With zero error positioning and expandable base, it can meet various welding needs.
3. Contains strong magnets to ensure that the welding steel mesh fits tightly. Soft silicone, aluminum base, heat-resistant and easy to clean.
4. Durable structure: made of high-quality materials to ensure service life and reliability.
5. Compatible with chips with thickness less than 0.9mm, most smartphone chip auxiliary welding.
6. Universal expansion base, suitable for middle-layer positioning board.
7. High toughness, good elasticity, heat-resistant, non-slip, can withstand high temperatures up to 500℃.
8. High-strength magnetic steel mesh, strong magnetic adsorption design, ensures safer and more stable welding.
9. Strong magnetic adsorption ensures that the steel mesh is not easy to fall off or shift.
Product list:
1 x Tinning base.
1 x Silicone pad.
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