AMAOE PD-C Planting Tin Pad for iPhone A8-A17 CPU RAM BGA Reballing Platform, iPhone 6-15 Pro MAX CPU IC BGA chips reballing soldering repair, Mobile Phone BGA chip Adsorption Silicon Mat.
Amaoe PD-C Tin Planting Pad high-temperature resistant insulating silicone pad. Amaoe PD-C pad used with a magnetic positioning base and is suitable for tin implantation and welding of chips with a thickness of less than 0.9mm.
Option:
1. Amaoe PD-C Tin Planting Pad only.
2. Amaoe PD-C pad with magnet base set
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